Advances in X-Ray Analysis: Volume 33 by B. K. Tanner (auth.), Charles S. Barrett, John V.

By B. K. Tanner (auth.), Charles S. Barrett, John V. Gilfrich, Ting C. Huang, Ron Jenkins, Paul K. Predecki (eds.)

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No strain. have halfwidths above 30. Virtually no grains of the undeformed material have such higher values. Isothermal anneals were carried out at 593, 649 and 704°C for timeq between 0 and 30 min. As may be seen from Fig. 7, strain redistributions took place with the mean reverting towards the original distribution. Based on the approach of Johnson and Mehl [17] and of Avrami [18], the thermal recovery of strained specimens can be expressed in the form k X = l-exp( -Bt ) (3) where X is the fraction representing degree of recovery, t is the isothermal annealing time, and Band k are material and process parameters.

B. Cohen and J. E. ), Materials Science Conferences,36, pg. 341, Gordon Beach, NY (1966). C. B. McDowell and T. C. Pilkington, "X-ray Diffraction Method for Determining Strain Distributions in Thin Metallic Films with Application to Gold Films", J. Appl. , 42,1958 (1971). C. R. Houska and T. M. Smith, "Least Squares Analysis of X-ray Diffraction Line Shapes with Analytical Functions", J. Appl. , 52, 748 (1981). 32 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. I. CHARACTERIZATION OF EPITAXIAL THIN FILMS BY X-RAY DIFFRACTION M.

16. 17. 18. 19. I. CHARACTERIZATION OF EPITAXIAL THIN FILMS BY X-RAY DIFFRACTION M. , 26, 175 (1978). H. DOlle and J. B. Cohen, "Determining Stress Analysis from Powder Diffraction Patterns", pg. 1453, in NBS Special Publication #567 (1980). Metals Handbook, 9th Edition, 2, 176 (1982). E. Kula and V. ) "Residual Stress and Stress Relaxation", pg. , 28, Plenum Press, New York (1982). B. Borie, C. J. Sparks and J. V. , 10, 691 (1962). P. Georgopoulos, J. B. Cohen and H. Herman, "Residual Stress Measurements of a Plasma Sprayed Coating System Using Synchrotron X-Radiation", Mat.

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